IEC 61189-2:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Fecha:

2006-05-30 /Vigente

Resumen (inglés):

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Resumen (francés):

Relaciones con otras normas IEC

Anula a: IEC 61189-2:1997
Anula a: IEC 61189-2:1997/AMD1:2000

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