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IEC 60068-2-20:2021 RLV

IEC 60068-2-20:2021 RLV

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

Fecha:
2021-03-30 /Vigente
Resumen (inglés):
IEC 60068-2-20:2021 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

IEC 60068-2-20:2021 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this document include the solder bath method and soldering iron method. The objective of this document is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering. This edition includes the following significant technical changes with respect to the previous edition:
- update of and clarification of pre-conditioning (former "aging") and its relation to natural aging.

Resumen (francés):

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