IEC 63011-2:2018

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

Circuits intégrés - Circuits intégrés tridimensionnels - Partie 2: Alignement de puces empilées à petits pas d'interconnexion

Fecha:

2018-11-28 /Vigente

Resumen (inglés):

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

Resumen (francés):

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