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IEC PAS 62137-3:2008

IEC PAS 62137-3:2008

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

2008-11-13 /Anulada
Resumen (inglés):
IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.
Resumen (francés):

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