IEC PAS 61249-3-1:2007

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Fecha:

2007-05-30 /Anulada

Resumen (inglés):

Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types

Resumen (francés):

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