IEC 60191-6-12:2002

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

Fecha:

2011-06-08 /Anulada

Resumen (inglés):

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

Resumen (francés):

Relaciones con otras normas IEC

Es anulada por: IEC 60191-6-12:2011

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