IEC 60191-3B:1978

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement

Normalisation mécanique des dispositifs à semiconducteurs - Troisième partie: Règles générales pour la préparation des dessins d'encombrement des circuits intégrés - Deuxième complément

Fecha:

1999-10-29 /Anulada

Resumen (inglés):

Completes IEC 60191-3 by defining in a more satisfactory manner the mounted length and width of DIL and QUIL packages and giving recommendations for the bending of terminals of QUIL packages used for the mounting of integrated circuits. It also lists the dimensions permitting the definition of the families of packages of Form 3 and Form 4.

Resumen (francés):

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