IEC 60068-2-69:1995

Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

Essai d'environnement - Partie 2: Essais - Essai Te: Essai de brasabilité des composants électroniques pour la technologie de montage en surface par la méthode de la balance de mouillage

Fecha:

2007-05-09 /Anulada

Resumen (inglés):

Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.

Resumen (francés):

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Es anulada por: IEC 60068-2-69:2007

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