IEC 60749-37:2008

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d'un accéléromètre

Fecha:

2022-10-12 /Anulada

Resumen (inglés):

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

Resumen (francés):

Relaciones con otras normas IEC

Es anulada por: IEC 60749-37:2022
Anula a: IEC PAS 62050:2004

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