IEC 60749-32:2002

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 32: Inflammabilité des dispositifs à encapsulation plastique (cas d'une cause extérieure d'inflammation)

Fecha:

2002-08-30 /Vigente

Resumen (inglés):

Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. The contents of the corrigendum of August 2003 have been included in this copy.

Resumen (francés):

Relaciones con otras normas IEC

Es modificada por: IEC 60749-32:2002/COR1:2003
Es modificada por: IEC 60749-32:2002/AMD1:2010

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