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IEC 60749-30:2005+AMD1:2011 CSV

IEC 60749-30:2005+AMD1:2011 CSV

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 30: Préconditionnement des composants pour montage en surface non hermétiques avant les essais de fiabilité

Fecha:
2020-08-17 /Anulada
Resumen (inglés):
IEC 60749-30:2005+A1:2011 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This consolidated version consists of the first edition (2005) and its amendment 1 (2011). Therefore, no need to order amendment in addition to this publication.
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