IEC 60749-15:2010

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Dispositifs à semiconducteurs - Méthodes d'essai mécaniques et climatiques - Partie 15: Résistance à la température de soudage pour dispositifs par trous traversants

Fecha:

2020-07-14 /Anulada

Resumen (inglés):

IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.

Resumen (francés):

Relaciones con otras normas IEC

Es anulada por: IEC 60749-15:2020
Anula a: IEC 60749-15:2003

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