IEC 62148-19:2019

Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package

Composants et dispositifs actifs fibroniques - Normes de boîtier et d’interface - Partie 19 : Boîtier à puce photonique

Fecha:

2019-05-02 /Vigente

Resumen (inglés):

IEC 62148-19: 2019 covers the photonic chip scale package. The purpose of this document is to specify adequately the physical requirements of optical transmitters and receivers that will enable mechanical interchangeability of transmitters and receivers. Keywords: physical interface for photonic chip scale packages

Resumen (francés):

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