Resumen (inglés):
IEC 60512-16-21:2012 The object of this standard is to define a standard test method to assess the possibility of whisker growth by external mechanical stress on the tin and tin-alloy plated parts of a connector in its application (after wire termination, after soldering, after mounting, mated with counterpart). This standard does not cover internal stress type whisker. This part of IEC 60512, when required by the detail specification, is used for testing connectors within the scope of IEC technical committee 48. It may also be used for similar devices when specified in a detail specification. Keywords: Whisker growth, external mechanical stress
