IEC 61190-1-2:2007

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques

Fecha:

2014-02-19 /Anulada

Resumen (inglés):

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Resumen (francés):

Relaciones con otras normas IEC

Es anulada por: IEC 61190-1-2:2014
Anula a: IEC 61190-1-2:2002

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