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IEC 60749-34:2004

IEC 60749-34:2004

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 34: Cycles en puissance

Fecha:
2010-10-28 /Anulada
Resumen (inglés):
Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.
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