Resumen (inglés):
Specifies the general requirements of enamelled round copper winding wires with or without bonding layer. This publication supersedes IEC 60182-1 (1984) and IEC 60182-2 (1987).
This consolidated version consists of the second edition (1997),
its amendment 1 (1999) and its amendment 2 (2005). Therefore, no
need to order amendments in addition to this publication.