IEC 60191-5:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 5: Recommandations applicables aux boîtiers à transfert automatisé sur bande (TAB) des circuits intégrés

Fecha:

1997-04-23 /Vigente

Resumen (inglés):

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

Resumen (francés):

Relaciones con otras normas IEC

Anula a: IEC 60191-5:1987

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