IEC TR 60286-7:2019

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

Emballage de composants pour opérations automatisées - Partie 7: Introduction d’une plaquette thermoformée en volume pour des composants miniaturisés

Fecha:

2019-10-14 /Vigente

Resumen (inglés):

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Resumen (francés):

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Esta norma está disponible en:

Formato digital

Ingles / Bilingue