IEC 61188-5-4:2007

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-4: Considérations sur les liaisons pistes-soudures - Composants à sorties en J sur deux côtés

Fecha:

2007-10-30 /Vigente

Resumen (inglés):

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Resumen (francés):

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