IEC 61190-1-2:2002

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences relatives aux crèmes de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques

Fecha:

2007-04-26 /Anulada

Resumen (inglés):

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Resumen (francés):

Relaciones con otras normas IEC

Es anulada por: IEC 61190-1-2:2007

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