IEC 60352-5:2008

Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance

Connexions sans soudure - Partie 5: Connexions insérées à force - Exigences générales, méthodes d'essai et guide pratique

Fecha:

2012-02-22 /Anulada

Resumen (inglés):

Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.

Resumen (francés):

Relaciones con otras normas IEC

Es anulada por: IEC 60352-5:2012
Anula a: IEC 60352-5:2001
Anula a: IEC 60352-5:2001+AMD1:2003 CSV
Anula a: IEC 60352-5:2001/AMD1:2003

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