IEC 60068-2-58/FRAGF ED3

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Essais d'environnement - Partie 2-58: Essais - Essai Td: Méthodes d'essai de la soudabilité, résistance de la métallisation à la dissolution et résistance à la chaleur de brasage des composants pour montage en surface (CMS)

Fecha:

2005-02-23 /Anulada

Resumen (inglés):

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.

Resumen (francés):

Relaciones con otras normas IEC

Es modificada por: IEC 60268-5:1989/AMD1:1993
Es modificada por: IEC 60268-5:1989/AMD2:1996
Es anulada por: IEC 60268-5:2003
Anula a: IEC 60268-5:1972

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